Patohia: Solder Paste, Tito: Bi58Sn42 (58/42), Tohu rewa: 281°F (138°C), Momo Pakihi: No-Clean,
Patohia: Solder Paste, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Tohu rewa: 423°F (217°C), Momo Pakihi: Water Soluble,
Patohia: Solder Paste, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Tohu rewa: 423°F (217°C), Momo Pakihi: No-Clean,
Patohia: Wire Solder, Tohu rewa: 428 ~ 454°F (219 ~ 235°C), Momo Pakihi: No-Clean, Tohu Waea: 21 AWG, 22 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.031" (0.79mm), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean, Tohu Waea: 20 AWG, 22 SWG,
Patohia: Wire Solder, Tito: Sn99.3Cu0.7 (99.3/0.7), Taimana: 0.062" (1.57mm), Tohu rewa: 441°F (227°C), Momo Pakihi: Water Soluble, Tohu Waea: 14 AWG, 16 SWG,
Patohia: Wire Solder, Tito: Sn99.3Cu0.7 (99.3/0.7), Taimana: 0.020" (0.51mm), Tohu rewa: 441°F (227°C), Momo Pakihi: No-Clean, Tohu Waea: 24 AWG, 25 SWG,
Patohia: Wire Solder, Tito: Sn99.3Cu0.7 (99.3/0.7), Taimana: 0.015" (0.38mm), Tohu rewa: 441°F (227°C), Momo Pakihi: Water Soluble, Tohu Waea: 27 AWG, 28 SWG,
Patohia: Wire Solder, Tito: Sn99.3Cu0.7 (99.3/0.7), Taimana: 0.020" (0.51mm), Tohu rewa: 441°F (227°C), Momo Pakihi: Water Soluble, Tohu Waea: 24 AWG, 25 SWG,
Patohia: Wire Solder, Tito: Sn99.3Cu0.7 (99.3/0.7), Taimana: 0.025" (0.64mm), Tohu rewa: 441°F (227°C), Momo Pakihi: No-Clean, Tohu Waea: 22 AWG, 23 SWG,
Patohia: Wire Solder, Tito: Sn99.3Cu0.7 (99.3/0.7), Taimana: 0.025" (0.64mm), Tohu rewa: 441°F (227°C), Momo Pakihi: Water Soluble, Tohu Waea: 22 AWG, 23 SWG,
Patohia: Wire Solder, Tito: Sn99.3Cu0.7 (99.3/0.7), Taimana: 0.050" (1.27mm), Tohu rewa: 441°F (227°C), Momo Pakihi: No-Clean, Tohu Waea: 16 AWG, 18 SWG,
Patohia: Wire Solder, Tito: Sn99.3Cu0.7 (99.3/0.7), Taimana: 0.050" (1.27mm), Tohu rewa: 441°F (227°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 16 AWG, 18 SWG,
Patohia: Wire Solder, Tito: Sn99.3Cu0.7 (99.3/0.7), Taimana: 0.031" (0.79mm), Tohu rewa: 441°F (227°C), Momo Pakihi: Water Soluble, Tohu Waea: 20 AWG, 22 SWG,
Patohia: Wire Solder, Tito: Sn62Pb36Ag2 (62/36/2), Taimana: 0.025" (0.64mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 22 AWG, 23 SWG,
Patohia: Wire Solder, Tito: Sn99.3Cu0.7 (99.3/0.7), Taimana: 0.020" (0.51mm), Tohu rewa: 441°F (227°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 24 AWG, 25 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.050" (1.27mm), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean, Tohu Waea: 16 AWG, 18 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.020" (0.51mm), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean, Tohu Waea: 24 AWG, 25 SWG,
Patohia: Wire Solder, Tito: Sn99.3Cu0.7 (99.3/0.7), Taimana: 0.025" (0.64mm), Tohu rewa: 441°F (227°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 22 AWG, 23 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.015" (0.38mm), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean, Tohu Waea: 27 AWG, 28 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.010" (0.25mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 30 AWG, 33 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.040" (1.02mm), Tohu rewa: 423 ~ 424°F (217 ~ 218°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 18 AWG, 19 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.015" (0.38mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 27 AWG, 28 SWG,
Patohia: Wire Solder, Tito: Sn60Pb40 (60/40), Taimana: 0.025" (0.64mm), Tohu rewa: 361 ~ 374°F (183 ~ 190°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 22 AWG, 23 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.040" (1.02mm), Tohu rewa: 423 ~ 424°F (217 ~ 218°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 18 AWG, 19 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.031" (0.79mm), Tohu rewa: 423 ~ 424°F (217 ~ 218°C), Momo Pakihi: No-Clean, Tohu Waea: 20 AWG, 22 SWG,
Patohia: Wire Solder, Tito: Sn62Pb36Ag2 (62/36/2), Taimana: 0.015" (0.38mm), Tohu rewa: 354°F (179°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 27 AWG, 28 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.050" (1.27mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 16 AWG, 18 SWG,
Patohia: Wire Solder, Tito: Sn60Pb40 (60/40), Taimana: 0.020" (0.51mm), Tohu rewa: 361 ~ 374°F (183 ~ 190°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 24 AWG, 25 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.015" (0.38mm), Tohu rewa: 423 ~ 424°F (217 ~ 218°C), Momo Pakihi: No-Clean, Tohu Waea: 27 AWG, 28 SWG,
