Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.031" (0.79mm), Tohu rewa: 423 ~ 424°F (217 ~ 218°C), Momo Pakihi: No-Clean, Tohu Waea: 20 AWG, 22 SWG,
Patohia: Wire Solder, Tito: Pb93.5Sn5Ag1.5 (93.5/5/1.5), Taimana: 0.031" (0.79mm), Tohu rewa: 565 ~ 574°F (296 ~ 301°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 20 AWG, 22 SWG,
Patohia: Wire Solder, Tito: Sn95Sb5 (95/5), Taimana: 0.025" (0.64mm), Tohu rewa: 450 ~ 464°F (232 ~ 240°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 22 AWG, 23 SWG,
Patohia: Wire Solder, Tito: Sn95Sb5 (95/5), Taimana: 0.031" (0.79mm), Tohu rewa: 450 ~ 464°F (232 ~ 240°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 20 AWG, 22 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.020" (0.51mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 24 AWG, 25 SWG,
Patohia: Wire Solder, Tito: Sn96.3Ag3.7 (96.3/3.7), Taimana: 0.015" (0.38mm), Tohu rewa: 430 ~ 444°F (221 ~ 223°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 27 AWG, 28 SWG,
Patohia: Wire Solder, Tito: Sn95Sb5 (95/5), Taimana: 0.031" (0.79mm), Tohu rewa: 450 ~ 464°F (232 ~ 240°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 20 AWG, 22 SWG,
Patohia: Wire Solder, Tito: Sn96.3Ag3.7 (96.3/3.7), Taimana: 0.015" (0.38mm), Tohu rewa: 430 ~ 444°F (221 ~ 223°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 27 AWG, 28 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.015" (0.38mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 27 AWG, 28 SWG,
Patohia: Wire Solder, Tito: Sn95Sb5 (95/5), Taimana: 0.050" (1.27mm), Tohu rewa: 450 ~ 464°F (232 ~ 240°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 16 AWG, 18 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.025" (0.64mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 22 AWG, 23 SWG,
Patohia: Wire Solder, Tito: Sn96.3Ag3.7 (96.3/3.7), Taimana: 0.031" (0.79mm), Tohu rewa: 430 ~ 444°F (221 ~ 223°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 20 AWG, 22 SWG,
Patohia: Wire Solder, Tito: Sn95Ag5 (95/5), Taimana: 0.040" (1.02mm), Tohu rewa: 430 ~ 473°F (221 ~ 245°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 18 AWG, 19 SWG,
Patohia: Wire Solder, Tito: Pb88Sn10Ag2 (88/10/2), Taimana: 0.040" (1.02mm), Tohu rewa: 514 ~ 570°F (268 ~ 299°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 18 AWG, 19 SWG,
Patohia: Wire Solder, Tito: Sn95Sb5 (95/5), Taimana: 0.062" (1.57mm), Tohu rewa: 450 ~ 464°F (232 ~ 240°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 14 AWG, 16 SWG,
Patohia: Wire Solder, Tito: Sn96.3Ag3.7 (96.3/3.7), Taimana: 0.020" (0.51mm), Tohu rewa: 430 ~ 444°F (221 ~ 223°C), Momo Pakihi: No-Clean, Tohu Waea: 24 AWG, 25 SWG,
Patohia: Wire Solder, Tito: Pb93.5Sn5Ag1.5 (93.5/5/1.5), Taimana: 0.063" (1.60mm), Tohu rewa: 565 ~ 574°F (296 ~ 301°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 14 AWG, 16 SWG,
Patohia: Wire Solder, Tito: Sn96.3Ag3.7 (96.3/3.7), Taimana: 0.031" (0.79mm), Tohu rewa: 430 ~ 444°F (221 ~ 223°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 20 AWG, 22 SWG,
Patohia: Wire Solder, Tito: Sn63Pb36.65Sb0.35 (63/36.65/0.35), Taimana: 0.020" (0.51mm), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 24 AWG, 25 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.031" (0.79mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 20 AWG, 22 SWG,
Patohia: Wire Solder, Tito: Sn95Ag5 (95/5), Taimana: 0.031" (0.79mm), Tohu rewa: 430 ~ 473°F (221 ~ 245°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 20 AWG, 22 SWG,
Patohia: Wire Solder, Tito: Sn96.3Ag3.7 (96.3/3.7), Taimana: 0.020" (0.51mm), Tohu rewa: 430 ~ 444°F (221 ~ 223°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 24 AWG, 25 SWG,
Patohia: Wire Solder, Tito: Sn62Pb36Ag2 (62/36/2), Taimana: 0.015" (0.38mm), Tohu rewa: 354°F (179°C), Momo Pakihi: No-Clean, Tohu Waea: 27 AWG, 28 SWG,
Patohia: Wire Solder, Tito: Sn95Ag5 (95/5), Taimana: 0.062" (1.57mm), Tohu rewa: 430 ~ 473°F (221 ~ 245°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 14 AWG, 16 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.062" (1.57mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 14 AWG, 16 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.015" (0.38mm), Tohu rewa: 423 ~ 424°F (217 ~ 218°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 27 AWG, 28 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3.5 (96.5/3.5), Taimana: 0.020" (0.51mm), Tohu rewa: 430°F (221°C), Momo Pakihi: No-Clean, Tohu Waea: 24 AWG, 25 SWG,
Patohia: Wire Solder, Tito: Sn96.3Ag3.7 (96.3/3.7), Taimana: 0.025" (0.64mm), Tohu rewa: 430 ~ 444°F (221 ~ 223°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 22 AWG, 23 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.040" (1.02mm), Tohu rewa: 423 ~ 424°F (217 ~ 218°C), Momo Pakihi: Water Soluble, Tohu Waea: 18 AWG, 19 SWG,
