Patohia: Solder Paste, Tito: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Tohu rewa: 411 ~ 424°F (209 ~ 218°C), Momo Pakihi: No-Clean,
Patohia: Solder Paste, Tito: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Tohu rewa: 410 ~ 424°F (209 ~ 218°C), Momo Pakihi: No-Clean,
Patohia: Solder Paste, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Tohu rewa: 423°F (217°C), Momo Pakihi: No-Clean,
Patohia: Solder Paste, Tito: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Tohu rewa: 409 ~ 424°F (209 ~ 218°C), Momo Pakihi: No-Clean,
Patohia: Solder Paste, Tito: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Tohu rewa: 408 ~ 424°F (209 ~ 218°C), Momo Pakihi: No-Clean,
Patohia: Solder Paste, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Tohu rewa: 350°F (177°C), Momo Pakihi: No-Clean,
Patohia: Solder Paste, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Tohu rewa: 401 ~ 424°F (205 ~ 218°C), Momo Pakihi: No-Clean,
Patohia: Solder Paste, Tito: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Tohu rewa: 423°F (217°C), Momo Pakihi: No-Clean,
Patohia: Solder Paste, Tito: Sn63Pb37 (63/37), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean,
Patohia: Solder Paste, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Tohu rewa: 423°F (217°C),
Patohia: Solder Paste, Tohu rewa: 546 ~ 567°F (286 ~ 297°C),
Patohia: Wire Solder, Tito: Sn60Pb40 (60/40), Taimana: 0.064" (1.63mm), Tohu rewa: 361 ~ 374°F (183 ~ 190°C), Momo Pakihi: No-Clean, Tohu Waea: 14 AWG, 16 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.015" (0.38mm), Tohu rewa: 361°F (183°C), Tohu Waea: 27 AWG, 28 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.125" (3.18mm), Tohu rewa: 361°F (183°C), Tohu Waea: 8 AWG, 10 SWG,
Patohia: Wire Solder, Tito: Sn60Pb40 (60/40), Taimana: 0.062" (1.57mm), Tohu rewa: 361 ~ 374°F (183 ~ 190°C), Tohu Waea: 14 AWG, 16 SWG,
Patohia: Wire Solder, Tito: Sn60Pb40 (60/40), Taimana: 0.125" (3.18mm), Tohu rewa: 361 ~ 374°F (183 ~ 190°C), Tohu Waea: 8 AWG, 10 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.062" (1.57mm), Tohu rewa: 361°F (183°C), Tohu Waea: 14 AWG, 16 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.093" (2.36mm), Tohu rewa: 423 ~ 424°F (217 ~ 218°C), Tohu Waea: 11 AWG, 13 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.125" (3.18mm), Tohu rewa: 423 ~ 424°F (217 ~ 218°C), Tohu Waea: 8 AWG, 10 SWG,
Patohia: Wire Solder, Tito: Sn99 (99), Taimana: 0.045" (1.14mm), Tohu Waea: 17 AWG, 18 SWG,
Patohia: Wire Solder, Tito: Sn99 (99), Taimana: 0.078" (1.98mm), Tohu Waea: 12 AWG, 14 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.031" (0.79mm), Tohu rewa: 361°F (183°C), Tohu Waea: 20 AWG, 22 SWG,
Patohia: Wire Solder, Tito: Sn99 (99), Taimana: 0.062" (1.57mm), Tohu Waea: 14 AWG, 16 SWG,
Patohia: Wire Solder, Tito: Sn99.3Cu0.7 (99.3/0.7), Taimana: 0.047" (1.19mm), Tohu rewa: 440°F (227°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 17 AWG, 18 SWG,
Patohia: Wire Solder, Tito: Sn99.3Cu0.7 (99.3/0.7), Taimana: 0.039" (0.99mm), Tohu rewa: 440°F (227°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 18 AWG, 19 SWG,
Patohia: Wire Solder, Tito: Sn60Pb40 (60/40), Taimana: 0.047" (1.19mm), Tohu rewa: 360°F (180°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 17 AWG, 18 SWG,