Patohia: Wire Solder, Tito: Sn60Pb40 (60/40), Taimana: 0.031" (0.79mm), Tohu rewa: 361 ~ 374°F (183 ~ 190°C), Momo Pakihi: No-Clean, Tohu Waea: 20 AWG, 22 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.025" (0.64mm), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean, Tohu Waea: 22 AWG, 23 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.010" (0.25mm), Tohu rewa: 423 ~ 424°F (217 ~ 218°C), Momo Pakihi: Water Soluble, Tohu Waea: 30 AWG, 33 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.020" (0.51mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Water Soluble, Tohu Waea: 24 AWG, 25 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.020" (0.51mm), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean, Tohu Waea: 24 AWG, 25 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.040" (1.02mm), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean, Tohu Waea: 18 AWG, 19 SWG,
Patohia: Wire Solder, Tito: Sn99.3Cu0.7 (99.3/0.7), Taimana: 0.025" (0.64mm), Tohu rewa: 441°F (227°C), Momo Pakihi: No-Clean, Tohu Waea: 22 AWG, 23 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.025" (0.64mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 22 AWG, 23 SWG,
Patohia: Wire Solder, Tito: Sn99.3Cu0.7 (99.3/0.7), Taimana: 0.040" (1.02mm), Tohu rewa: 441°F (227°C), Momo Pakihi: No-Clean, Tohu Waea: 18 AWG, 19 SWG,
Patohia: Wire Solder, Tito: Sn99.3Cu0.7 (99.3/0.7), Taimana: 0.047" (1.19mm), Tohu rewa: 441°F (227°C), Momo Pakihi: No-Clean, Tohu Waea: 17 AWG, 18 SWG,
Patohia: Wire Solder, Tito: Sn99.3Cu0.7 (99.3/0.7), Taimana: 0.031" (0.79mm), Tohu rewa: 441°F (227°C), Momo Pakihi: No-Clean, Tohu Waea: 20 AWG, 22 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.031" (0.79mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 20 AWG, 22 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.062" (1.57mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 14 AWG, 16 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.031" (0.79mm), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean, Tohu Waea: 20 AWG, 22 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.015" (0.38mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Water Soluble, Tohu Waea: 27 AWG, 28 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.015" (0.38mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 27 AWG, 28 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.031" (0.79mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Water Soluble, Tohu Waea: 20 AWG, 22 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.062" (1.57mm), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean, Tohu Waea: 14 AWG, 16 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.015" (0.38mm), Tohu rewa: 423 ~ 424°F (217 ~ 218°C), Momo Pakihi: Water Soluble, Tohu Waea: 27 AWG, 28 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.015" (0.38mm), Tohu rewa: 423 ~ 424°F (217 ~ 218°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 27 AWG, 28 SWG,
Patohia: Wire Solder, Tito: Sn60Pb40 (60/40), Taimana: 0.015" (0.38mm), Tohu rewa: 361 ~ 374°F (183 ~ 190°C), Momo Pakihi: No-Clean, Tohu Waea: 27 AWG, 28 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.025" (0.64mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Water Soluble, Tohu Waea: 22 AWG, 23 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.047" (1.19mm), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean, Tohu Waea: 17 AWG, 18 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3.5 (96.5/3.5), Taimana: 0.015" (0.38mm), Tohu rewa: 430°F (221°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 27 AWG, 28 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.010" (0.25mm), Tohu rewa: 423 ~ 424°F (217 ~ 218°C), Momo Pakihi: No-Clean, Tohu Waea: 30 AWG, 33 SWG,
Patohia: Bar Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Tohu rewa: 423°F (217°C),
