Patohia: Solder Paste, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Tohu rewa: 423 ~ 424°F (217 ~ 218°C), Momo Pakihi: No-Clean,
Patohia: Solder Paste, Tito: Sn63Pb37 (63/37), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean,
Patohia: Solder Paste, Tito: Sn63Pb37 (63/37), Tohu rewa: 361°F (183°C), Momo Pakihi: Water Soluble,
Patohia: Solder Paste, Tito: Sn95Sb5 (95/5), Tohu rewa: 450 ~ 464°F (232 ~ 240°C), Momo Pakihi: No-Clean,
Patohia: Solder Paste, Tito: Sn96.3Ag3.7 (96.3/3.7), Tohu rewa: 430 ~ 444°F (221 ~ 223°C), Momo Pakihi: No-Clean,
Patohia: Solder Paste, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Tohu rewa: 423 ~ 424°F (217 ~ 218°C), Momo Pakihi: Water Soluble,
Patohia: Solder Paste, Tito: Sn99Cu0.7Ag0.3 (99/0.7/0.3), Momo Pakihi: No-Clean,
Patohia: Solder Paste, Tito: Sn62Pb36Ag2 (62/36/2), Tohu rewa: 354°F (179°C), Momo Pakihi: Water Soluble,
Patohia: Solder Paste, Tito: Sn62Pb36Ag2 (62/36/2), Tohu rewa: 354°F (179°C), Momo Pakihi: No-Clean,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.064" (1.63mm), Tohu rewa: 423°F (217°C), Momo Pakihi: No-Clean, Tohu Waea: 14 AWG, 16 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.064" (1.63mm), Tohu rewa: 423°F (217°C), Momo Pakihi: Water Soluble, Tohu Waea: 14 AWG, 16 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.015" (0.38mm), Tohu rewa: 423°F (217°C), Momo Pakihi: No-Clean, Tohu Waea: 27 AWG, 28 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.015" (0.38mm), Tohu rewa: 423°F (217°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 27 AWG, 28 SWG,
