Pata

386844

Wahanga Tapeke: 3649

Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.015" (0.38mm), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean, Tohu Waea: 27 AWG, 28 SWG,

Ki te hiahia

389283

Wahanga Tapeke: 4005

Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.015" (0.38mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Water Soluble, Tohu Waea: 27 AWG, 28 SWG,

Ki te hiahia

386826

Wahanga Tapeke: 9072

Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.024" (0.61mm), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean, Tohu Waea: 22 AWG, 23 SWG,

Ki te hiahia

386840

Wahanga Tapeke: 9036

Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.024" (0.61mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 22 AWG, 23 SWG,

Ki te hiahia

412183

Wahanga Tapeke: 1331

Patohia: Wire Solder, Tito: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Taimana: 0.040" (1.02mm), Tohu rewa: 423°F (217°C), Momo Pakihi: No-Clean, Tohu Waea: 18 AWG, 19 SWG,

Ki te hiahia

412188

Wahanga Tapeke: 1725

Patohia: Wire Solder, Taimana: 0.015" (0.38mm), Momo Pakihi: No-Clean, Tohu Waea: 27 AWG, 28 SWG,

Ki te hiahia

412185

Wahanga Tapeke: 1962

Patohia: Wire Solder, Taimana: 0.022" (0.56mm), Momo Pakihi: No-Clean, Tohu Waea: 23 AWG, 24 SWG,

Ki te hiahia

49500-454G

Wahanga Tapeke: 973

Patohia: Wire Solder, Tito: Sn99.5Cu0.5 (99.5/0.5), Taimana: 0.032" (0.81mm), Tohu rewa: 442°F (228°C), Momo Pakihi: No-Clean, Tohu Waea: 20 AWG, 21 SWG,

Ki te hiahia

4897-227G

Wahanga Tapeke: 2564

Patohia: Wire Solder, Tito: Sn60Pb40 (60/40), Taimana: 0.050" (1.27mm), Tohu rewa: 361 ~ 376°F (183 ~ 191°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 16 AWG, 18 SWG,

Ki te hiahia

4885WS-454G

Wahanga Tapeke: 1636

Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.032" (0.81mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Water Soluble, Tohu Waea: 20 AWG, 21 SWG,

Ki te hiahia

4860P-500G

Wahanga Tapeke: 819

Patohia: Solder Paste, Tito: Sn63Pb37 (63/37), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean,

Ki te hiahia

4888-454G

Wahanga Tapeke: 1653

Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.062" (1.57mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 14 AWG, 16 SWG,

Ki te hiahia

4876-227G

Wahanga Tapeke: 2582

Patohia: Wire Solder, Tito: Sn60Pb40 (60/40), Taimana: 0.040" (1.02mm), Tohu rewa: 361 ~ 376°F (183 ~ 191°C), Momo Pakihi: No-Clean, Tohu Waea: 18 AWG, 19 SWG,

Ki te hiahia

4860P-35G

Wahanga Tapeke: 2573

Patohia: Solder Paste, Tito: Sn63Pb37 (63/37), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean,

Ki te hiahia

4886-454G

Wahanga Tapeke: 1658

Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.040" (1.02mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 18 AWG, 19 SWG,

Ki te hiahia

4926-454G

Wahanga Tapeke: 764

Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.040" (1.02mm), Tohu rewa: 423 ~ 430°F (217 ~ 221°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 18 AWG, 19 SWG,

Ki te hiahia

4915-454G

Wahanga Tapeke: 751

Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.040" (1.02mm), Tohu rewa: 423 ~ 430°F (217 ~ 221°C), Momo Pakihi: No-Clean, Tohu Waea: 18 AWG, 19 SWG,

Ki te hiahia

4925-454G

Wahanga Tapeke: 766

Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.032" (0.81mm), Tohu rewa: 423 ~ 430°F (217 ~ 221°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 20 AWG, 21 SWG,

Ki te hiahia

4894-454G

Wahanga Tapeke: 1625

Patohia: Wire Solder, Tito: Sn60Pb40 (60/40), Taimana: 0.025" (0.64mm), Tohu rewa: 361 ~ 376°F (183 ~ 191°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 22 AWG, 23 SWG,

Ki te hiahia

4897-454G

Wahanga Tapeke: 1625

Patohia: Wire Solder, Tito: Sn60Pb40 (60/40), Taimana: 0.050" (1.27mm), Tohu rewa: 361 ~ 376°F (183 ~ 191°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 16 AWG, 18 SWG,

Ki te hiahia

4916-454G

Wahanga Tapeke: 679

Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.050" (1.27mm), Tohu rewa: 423 ~ 430°F (217 ~ 221°C), Momo Pakihi: No-Clean, Tohu Waea: 16 AWG, 18 SWG,

Ki te hiahia

4887-454G

Wahanga Tapeke: 1634

Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.050" (1.27mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 16 AWG, 18 SWG,

Ki te hiahia

4887-227G

Wahanga Tapeke: 2546

Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.050" (1.27mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 16 AWG, 18 SWG,

Ki te hiahia

4942-454G

Wahanga Tapeke: 1032

Patohia: Wire Solder, Tito: Sn99.5Cu0.5 (99.5/0.5), Taimana: 0.032" (0.81mm), Tohu rewa: 442°F (228°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 20 AWG, 21 SWG,

Ki te hiahia

4885-454G

Wahanga Tapeke: 1662

Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.032" (0.81mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 20 AWG, 21 SWG,

Ki te hiahia

4935-454G

Wahanga Tapeke: 1259

Patohia: Wire Solder, Tito: Sn99.5Cu0.5 (99.5/0.5), Taimana: 0.032" (0.81mm), Tohu rewa: 442°F (228°C), Momo Pakihi: No-Clean, Tohu Waea: 20 AWG, 21 SWG,

Ki te hiahia

4933-112G

Wahanga Tapeke: 3363

Patohia: Wire Solder, Tito: Sn99.5Cu0.5 (99.5/0.5), Taimana: 0.020" (0.51mm), Tohu rewa: 442°F (228°C), Momo Pakihi: No-Clean, Tohu Waea: 24 AWG, 25 SWG,

Ki te hiahia

4900-227G

Wahanga Tapeke: 1299

Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.032" (0.81mm), Tohu rewa: 423 ~ 430°F (217 ~ 221°C), Momo Pakihi: No-Clean, Tohu Waea: 20 AWG, 21 SWG,

Ki te hiahia

4900-454G

Wahanga Tapeke: 671

Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.032" (0.81mm), Tohu rewa: 423 ~ 430°F (217 ~ 221°C), Momo Pakihi: No-Clean, Tohu Waea: 20 AWG, 21 SWG,

Ki te hiahia

4896-454G

Wahanga Tapeke: 1635

Patohia: Wire Solder, Tito: Sn60Pb40 (60/40), Taimana: 0.040" (1.02mm), Tohu rewa: 361 ~ 376°F (183 ~ 191°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 18 AWG, 19 SWG,

Ki te hiahia

4898-454G

Wahanga Tapeke: 1640

Patohia: Wire Solder, Tito: Sn60Pb40 (60/40), Taimana: 0.062" (1.57mm), Tohu rewa: 361 ~ 376°F (183 ~ 191°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 14 AWG, 16 SWG,

Ki te hiahia

4888-227G

Wahanga Tapeke: 2527

Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.062" (1.57mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 14 AWG, 16 SWG,

Ki te hiahia

4865-227G

Wahanga Tapeke: 2565

Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.032" (0.81mm), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean, Tohu Waea: 20 AWG, 21 SWG,

Ki te hiahia

49500WS-454G

Wahanga Tapeke: 981

Patohia: Wire Solder, Tito: Sn99.5Cu0.5 (99.5/0.5), Taimana: 0.032" (0.81mm), Tohu rewa: 442°F (228°C), Momo Pakihi: No-Clean, Tohu Waea: 20 AWG, 21 SWG,

Ki te hiahia

4933-454G

Wahanga Tapeke: 984

Patohia: Wire Solder, Tito: Sn99.5Cu0.5 (99.5/0.5), Taimana: 0.020" (0.51mm), Tohu rewa: 442°F (228°C), Momo Pakihi: No-Clean, Tohu Waea: 24 AWG, 25 SWG,

Ki te hiahia

4885-227G

Wahanga Tapeke: 2529

Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.032" (0.81mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 20 AWG, 21 SWG,

Ki te hiahia

1130

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