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Rfqs / ota
0Rfqs / ota

Pata

MMF301501
Micro-Measurements (Division of Vishay Precision G

MMF301501

Wahanga Tapeke: 143

Patohia: Wire Solder, Tito: Sn95Sb5 (95/5), Taimana: 0.020" (0.51mm), Tohu rewa: 450 ~ 460°F (232 ~ 238°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 24 AWG, 25 SWG,

Momotae
MMF006630
Micro-Measurements (Division of Vishay Precision G

MMF006630

Wahanga Tapeke: 491

Patohia: Solder Paste, Tito: Ag40Cu30Zn28Ni2 (40/30/28/2), Tohu rewa: 1220 ~ 1435°F (660 ~ 780°C),

Momotae
MMF006619
Micro-Measurements (Division of Vishay Precision G

MMF006619

Wahanga Tapeke: 2696

Patohia: Wire Solder, Tito: Sn63Pb36.65Sb0.35 (63/36.65/0.35), Taimana: 0.020" (0.51mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 24 AWG, 25 SWG,

Momotae
MMF006620
Micro-Measurements (Division of Vishay Precision G

MMF006620

Wahanga Tapeke: 751

Patohia: Wire Solder, Tito: Sn63Pb36.65Sb0.35 (63/36.65/0.35), Taimana: 0.020" (0.51mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 24 AWG, 25 SWG,

Momotae
MMF006622
Micro-Measurements (Division of Vishay Precision G

MMF006622

Wahanga Tapeke: 706

Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.040" (1.02mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 18 AWG, 19 SWG,

Momotae