Patohia: Wire Solder, Tito: Sn99.5Cu0.5 (99.5/0.5), Taimana: 0.032" (0.81mm), Tohu rewa: 442°F (228°C), Momo Pakihi: No-Clean, Tohu Waea: 20 AWG, 21 SWG,
Patohia: Wire Solder, Tito: Sn60Pb40 (60/40), Taimana: 0.050" (1.27mm), Tohu rewa: 361 ~ 376°F (183 ~ 191°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 16 AWG, 18 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.032" (0.81mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Water Soluble, Tohu Waea: 20 AWG, 21 SWG,
Patohia: Solder Paste, Tito: Sn63Pb37 (63/37), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.062" (1.57mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 14 AWG, 16 SWG,
Patohia: Wire Solder, Tito: Sn60Pb40 (60/40), Taimana: 0.040" (1.02mm), Tohu rewa: 361 ~ 376°F (183 ~ 191°C), Momo Pakihi: No-Clean, Tohu Waea: 18 AWG, 19 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.040" (1.02mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 18 AWG, 19 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.040" (1.02mm), Tohu rewa: 423 ~ 430°F (217 ~ 221°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 18 AWG, 19 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.040" (1.02mm), Tohu rewa: 423 ~ 430°F (217 ~ 221°C), Momo Pakihi: No-Clean, Tohu Waea: 18 AWG, 19 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.032" (0.81mm), Tohu rewa: 423 ~ 430°F (217 ~ 221°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 20 AWG, 21 SWG,
Patohia: Wire Solder, Tito: Sn60Pb40 (60/40), Taimana: 0.025" (0.64mm), Tohu rewa: 361 ~ 376°F (183 ~ 191°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 22 AWG, 23 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.050" (1.27mm), Tohu rewa: 423 ~ 430°F (217 ~ 221°C), Momo Pakihi: No-Clean, Tohu Waea: 16 AWG, 18 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.050" (1.27mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 16 AWG, 18 SWG,
Patohia: Wire Solder, Tito: Sn99.5Cu0.5 (99.5/0.5), Taimana: 0.032" (0.81mm), Tohu rewa: 442°F (228°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 20 AWG, 21 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.032" (0.81mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 20 AWG, 21 SWG,
Patohia: Wire Solder, Tito: Sn99.5Cu0.5 (99.5/0.5), Taimana: 0.020" (0.51mm), Tohu rewa: 442°F (228°C), Momo Pakihi: No-Clean, Tohu Waea: 24 AWG, 25 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.032" (0.81mm), Tohu rewa: 423 ~ 430°F (217 ~ 221°C), Momo Pakihi: No-Clean, Tohu Waea: 20 AWG, 21 SWG,
Patohia: Wire Solder, Tito: Sn60Pb40 (60/40), Taimana: 0.040" (1.02mm), Tohu rewa: 361 ~ 376°F (183 ~ 191°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 18 AWG, 19 SWG,
Patohia: Wire Solder, Tito: Sn60Pb40 (60/40), Taimana: 0.062" (1.57mm), Tohu rewa: 361 ~ 376°F (183 ~ 191°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 14 AWG, 16 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.032" (0.81mm), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean, Tohu Waea: 20 AWG, 21 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.020" (0.51mm), Tohu rewa: 423 ~ 430°F (217 ~ 221°C), Momo Pakihi: No-Clean, Tohu Waea: 24 AWG, 25 SWG,
Patohia: Wire Solder, Tito: Sn60Pb40 (60/40), Taimana: 0.032" (0.81mm), Tohu rewa: 361 ~ 376°F (183 ~ 191°C), Momo Pakihi: No-Clean, Tohu Waea: 20 AWG, 21 SWG,
Patohia: Solder Paste, Tito: Bi57Sn42Ag1 (57/42/1), Tohu rewa: 281°F (138°C), Momo Pakihi: No-Clean,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.062" (1.57mm), Tohu rewa: 423 ~ 430°F (217 ~ 221°C), Momo Pakihi: No-Clean, Tohu Waea: 14 AWG, 16 SWG,