Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.020" (0.51mm), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean, Tohu Waea: 24 AWG, 25 SWG,
Patohia: Wire Solder, Tito: Sn95Sb5 (95/5), Taimana: 0.062" (1.57mm), Tohu rewa: 450 ~ 464°F (232 ~ 240°C), Momo Pakihi: Water Soluble, Tohu Waea: 14 AWG, 16 SWG,
Patohia: Wire Solder, Tito: Sn60Pb40 (60/40), Taimana: 0.093" (2.36mm), Tohu rewa: 361 ~ 374°F (183 ~ 190°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 11 AWG, 13 SWG,
Patohia: Wire Solder, Tito: Sn99.3Cu0.7 (99.3/0.7), Taimana: 0.031" (0.79mm), Tohu rewa: 441°F (227°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 20 AWG, 22 SWG,
Patohia: Wire Solder, Tito: Sn50Pb50 (50/50), Taimana: 0.125" (3.18mm), Tohu rewa: 361 ~ 420°F (183 ~ 216°C), Momo Pakihi: Acid Cored, Tohu Waea: 8 AWG, 10 SWG,
Patohia: Wire Solder, Tito: Sn60Pb40 (60/40), Taimana: 0.050" (1.27mm), Tohu rewa: 361 ~ 374°F (183 ~ 190°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 16 AWG, 18 SWG,
Patohia: Wire Solder, Tito: Sn99.3Cu0.7 (99.3/0.7), Taimana: 0.031" (0.79mm), Tohu rewa: 441°F (227°C), Momo Pakihi: No-Clean, Tohu Waea: 20 AWG, 22 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.050" (1.27mm), Tohu rewa: 423 ~ 424°F (217 ~ 218°C), Momo Pakihi: No-Clean, Tohu Waea: 16 AWG, 18 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.062" (1.57mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 14 AWG, 16 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.062" (1.57mm), Tohu rewa: 423 ~ 424°F (217 ~ 218°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 14 AWG, 16 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.062" (1.57mm), Tohu rewa: 423 ~ 424°F (217 ~ 218°C), Momo Pakihi: No-Clean, Tohu Waea: 14 AWG, 16 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.025" (0.64mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 22 AWG, 23 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.025" (0.64mm), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean, Tohu Waea: 22 AWG, 23 SWG,
Patohia: Wire Solder, Tito: Sn60Pb40 (60/40), Taimana: 0.062" (1.57mm), Tohu rewa: 361 ~ 374°F (183 ~ 190°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 14 AWG, 16 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.020" (0.51mm), Tohu rewa: 423 ~ 424°F (217 ~ 218°C), Momo Pakihi: Water Soluble, Tohu Waea: 24 AWG, 25 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.020" (0.51mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 24 AWG, 25 SWG,
Patohia: Wire Solder, Tito: Sn99.3Cu0.7 (99.3/0.7), Taimana: 0.015" (0.38mm), Tohu rewa: 441°F (227°C), Momo Pakihi: No-Clean, Tohu Waea: 27 AWG, 28 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.020" (0.51mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 24 AWG, 25 SWG,
Patohia: Wire Solder, Tito: Sn60Pb40 (60/40), Taimana: 0.020" (0.51mm), Tohu rewa: 361 ~ 374°F (183 ~ 190°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 24 AWG, 25 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.031" (0.79mm), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean, Tohu Waea: 20 AWG, 22 SWG,
Patohia: Wire Solder, Tito: Sn99.3Cu0.7 (99.3/0.7), Taimana: 0.079" (2.01mm), Tohu rewa: 441°F (227°C), Tohu Waea: 12 AWG, 14 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.015" (0.38mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 27 AWG, 28 SWG,
Patohia: Wire Solder, Tito: Sn50Pb50 (50/50), Taimana: 0.093" (2.36mm), Tohu rewa: 361 ~ 420°F (183 ~ 216°C), Tohu Waea: 11 AWG, 13 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.050" (1.27mm), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean, Tohu Waea: 16 AWG, 18 SWG,
Patohia: Wire Solder, Tito: Sn60Pb40 (60/40), Taimana: 0.040" (1.02mm), Tohu rewa: 361 ~ 374°F (183 ~ 190°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 18 AWG, 19 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.015" (0.38mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Water Soluble, Tohu Waea: 27 AWG, 28 SWG,
Patohia: Wire Solder, Tito: Sn95Sb5 (95/5), Taimana: 0.031" (0.79mm), Tohu rewa: 450 ~ 464°F (232 ~ 240°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 20 AWG, 22 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.025" (0.64mm), Tohu rewa: 423 ~ 424°F (217 ~ 218°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 22 AWG, 23 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.020" (0.51mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Water Soluble, Tohu Waea: 24 AWG, 25 SWG,
Patohia: Wire Solder, Tito: Sn95Sb5 (95/5), Taimana: 0.125" (3.18mm), Tohu rewa: 450 ~ 464°F (232 ~ 240°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 8 AWG, 10 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.020" (0.51mm), Tohu rewa: 423 ~ 424°F (217 ~ 218°C), Momo Pakihi: No-Clean, Tohu Waea: 24 AWG, 25 SWG,
Patohia: Wire Solder, Tito: Sn95Ag5 (95/5), Taimana: 0.062" (1.57mm), Tohu rewa: 430 ~ 473°F (221 ~ 245°C), Momo Pakihi: Water Soluble, Tohu Waea: 14 AWG, 16 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.031" (0.79mm), Tohu rewa: 423 ~ 424°F (217 ~ 218°C), Momo Pakihi: Water Soluble, Tohu Waea: 20 AWG, 22 SWG,
