Patohia: Solder Paste, Tito: Sn63Pb37 (63/37), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean,
Patohia: Solder Paste, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Tohu rewa: 423 ~ 424°F (217 ~ 218°C), Momo Pakihi: Water Soluble,
Patohia: Solder Paste, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Tohu rewa: 423 ~ 424°F (217 ~ 218°C), Momo Pakihi: No-Clean,
Patohia: Solder Paste, Tito: Sn62Pb36Ag2 (62/36/2), Tohu rewa: 354°F (179°C), Momo Pakihi: Water Soluble,
Patohia: Solder Paste, Tito: Sn62Pb36Ag2 (62/36/2), Tohu rewa: 354°F (179°C), Momo Pakihi: No-Clean,
Patohia: Solder Paste, Tito: Sn63Pb37 (63/37), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Mildly Activated (RMA),
Patohia: Solder Paste, Tito: Sn63Pb37 (63/37), Tohu rewa: 361°F (183°C), Momo Pakihi: Water Soluble,
Patohia: Solder Paste, Tito: Sn99.3Cu0.7 (99.3/0.7), Tohu rewa: 441°F (227°C), Momo Pakihi: No-Clean,