Patohia: Wire Solder, Tito: Sn99.3Cu0.7 (99.3/0.7), Taimana: 0.022" (0.56mm), Tohu rewa: 440 ~ 464°F (227 ~ 240°C), Momo Pakihi: No-Clean, Tohu Waea: 23 AWG, 24 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.064" (1.63mm), Tohu rewa: 423°F (217°C), Momo Pakihi: No-Clean, Tohu Waea: 14 AWG, 16 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.064" (1.63mm), Tohu rewa: 423°F (217°C), Momo Pakihi: Water Soluble, Tohu Waea: 14 AWG, 16 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.015" (0.38mm), Tohu rewa: 423°F (217°C), Momo Pakihi: No-Clean, Tohu Waea: 27 AWG, 28 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.015" (0.38mm), Tohu rewa: 423°F (217°C), Momo Pakihi: Rosin Mildly Activated (RMA), Tohu Waea: 27 AWG, 28 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.032" (0.81mm), Tohu rewa: 423°F (217°C), Momo Pakihi: No-Clean, Tohu Waea: 20 AWG, 21 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.022" (0.56mm), Tohu rewa: 423°F (217°C), Momo Pakihi: No-Clean, Tohu Waea: 23 AWG, 24 SWG,
Patohia: Wire Solder, Tito: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Taimana: 0.032" (0.81mm), Tohu rewa: 423°F (217°C), Momo Pakihi: No-Clean, Tohu Waea: 20 AWG, 21 SWG,
Patohia: Wire Solder, Taimana: 0.032" (0.81mm), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean, Tohu Waea: 20 AWG, 21 SWG,
Patohia: Wire Solder, Tito: Sn99.3Cu0.7 (99.3/0.7), Taimana: 0.032" (0.81mm), Tohu rewa: 440 ~ 464°F (227 ~ 240°C), Momo Pakihi: No-Clean, Tohu Waea: 20 AWG, 21 SWG,
Patohia: Wire Solder, Taimana: 0.022" (0.56mm), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean, Tohu Waea: 23 AWG, 24 SWG,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.015" (0.38mm), Tohu rewa: 423°F (217°C), Momo Pakihi: Water Soluble, Tohu Waea: 27 AWG, 28 SWG,
Patohia: Wire Solder, Taimana: 0.025" (0.64mm), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean, Tohu Waea: 22 AWG, 23 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.028" (0.71mm), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean, Tohu Waea: 21 AWG, 22 SWG,
Patohia: Wire Solder, Taimana: 0.064" (1.63mm), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean, Tohu Waea: 14 AWG, 16 SWG,
Patohia: Bar Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Tohu rewa: 423°F (217°C),
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.024" (0.61mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Water Soluble, Tohu Waea: 22 AWG, 23 SWG,
Patohia: Wire Solder, Tito: Sn62Pb38 (62/38), Taimana: 0.032" (0.81mm), Tohu rewa: 361°F (183°C), Momo Pakihi: Rosin Activated (RA), Tohu Waea: 20 AWG, 21 SWG,