Patohia: Wire Solder, Tito: Sn99.3Cu0.7 (99.3/0.7), Taimana: 0.031" (0.79mm), Tohu rewa: 441°F (227°C), Momo Pakihi: No-Clean, Water Soluble, Tohu Waea: 20 AWG, 21 SWG,
Patohia: Solder Paste, Tito: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Tohu rewa: 281°F (138°C), Momo Pakihi: No-Clean,
Patohia: Solder Sphere, Tito: Sn63Pb37 (63/37), Taimana: 0.008" (0.20mm), Tohu rewa: 361°F (183°C),
Patohia: Solder Paste, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Tohu rewa: 423 ~ 428°F (217 ~ 220°C), Momo Pakihi: No-Clean,
Patohia: Solder Sphere, Tito: Sn63Pb37 (63/37), Taimana: 0.024" (0.61mm), Tohu rewa: 361°F (183°C),
Patohia: Wire Solder, Tito: Sn99.3Cu0.7 (99.3/0.7), Taimana: 0.015" (0.38mm), Tohu rewa: 441°F (227°C), Momo Pakihi: No-Clean, Water Soluble,
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.015" (0.38mm), Tohu rewa: 423 ~ 428°F (217 ~ 220°C), Momo Pakihi: No-Clean, Water Soluble, Tohu Waea: 27 AWG, 28 SWG,
Patohia: Wire Solder, Tito: Sn99.3Cu0.7 (99.3/0.7), Taimana: 0.031" (0.79mm), Tohu rewa: 441°F (227°C), Momo Pakihi: No-Clean, Water Soluble,
Patohia: Solder Sphere, Tito: Sn63Pb37 (63/37), Taimana: 0.030" (0.76mm), Tohu rewa: 361°F (183°C),
Patohia: Wire Solder, Tito: In97Ag3 (97/3), Taimana: 0.031" (0.79mm), Tohu rewa: 289°F (143°C), Tohu Waea: 20 AWG, 21 SWG,
Patohia: Wire Solder, Tito: Bi57Sn42Ag1 (57/42/1), Taimana: 0.030" (0.76mm), Tohu rewa: 281°F (138°C), Tohu Waea: 21 AWG, 22 SWG,
Patohia: Solder Sphere, Tito: Sn63Pb37 (63/37), Taimana: 0.020" (0.51mm), Tohu rewa: 361°F (183°C),
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.031" (0.79mm), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean, Water Soluble, Tohu Waea: 20 AWG, 21 SWG,
Patohia: Solder Paste, Tito: Sn63Pb37 (63/37), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean,
Patohia: Solder Paste, Tito: Sn63Pb37 (63/37), Tohu rewa: 361°F (183°C), Momo Pakihi: Water Soluble,
Patohia: Wire Solder, Tito: Sn62Pb36Ag2 (62/36/2), Taimana: 0.020" (0.51mm), Tohu rewa: 354°F (179°C), Momo Pakihi: No-Clean, Water Soluble,
Patohia: Solder Sphere, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.016" (0.40mm), Tohu rewa: 423 ~ 428°F (217 ~ 220°C),
Patohia: Solder Paste, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Tohu rewa: 423 ~ 428°F (217 ~ 220°C), Momo Pakihi: Water Soluble,
Patohia: Solder Sphere, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.018" (0.46mm), Tohu rewa: 423 ~ 428°F (217 ~ 220°C),
Patohia: Solder Sphere, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.008" (0.20mm), Tohu rewa: 423 ~ 428°F (217 ~ 220°C),
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.031" (0.79mm), Tohu rewa: 423 ~ 428°F (217 ~ 220°C), Momo Pakihi: No-Clean, Tohu Waea: 20 AWG, 22 SWG,
Patohia: Solder Sphere, Tito: Sn63Pb37 (63/37), Taimana: 0.012" (0.31mm), Tohu rewa: 361°F (183°C),
Patohia: Wire Solder, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.031" (0.79mm), Tohu rewa: 423 ~ 428°F (217 ~ 220°C), Momo Pakihi: No-Clean, Water Soluble, Tohu Waea: 20 AWG, 21 SWG,
Patohia: Wire Solder, Tito: Sn63Pb37 (63/37), Taimana: 0.031" (0.79mm), Tohu rewa: 361°F (183°C), Momo Pakihi: No-Clean, Water Soluble, Tohu Waea: 20 AWG, 22 SWG,
Patohia: Solder Sphere, Tito: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Taimana: 0.024" (0.61mm), Tohu rewa: 423 ~ 428°F (217 ~ 220°C),
